1. Features

•  1chip High-Luminosity Chip LED •  3.5 mm x 2.8 mm x 1.8 mm (L x W x H) small size surface mount type •  Wide Viewing angle •  Long operating life (up to 70,000 hours)

2. Applications

• Automotive: Backlight in dashboard and switch • Lighting device: Indicator, lighting • Camera flash, Hand Carrier Flash • General use

3. Outline Drawing and Dimension

	Unit : mm
	Tolerance : ±0.1

Notes: 1.  All dimensions are in millimeters 2.  All dimensions without tolerances are for reference only

4. Absolute Maximum Ratings ( Ta = 25 ℃ )

Parameter	Symbol	Value	Unit
Power Dissipation per chip	Pd	114	mW
Continuous Forward Current per chip	IF	30	mA
Peak Forward Current ※1	IFP	100	mA
Reverse Current	IR	100	mA
Operating Temperature	Topr	-30~85	℃
Storage Temperature	Tstg	-40~100	℃
Soldering Temperature	Tsol	260(5sec)	℃

※1 Duty ratio = 1/10, Pulse width = 0.1ms

5. Electro-optical Characteristics ( Ta = 25 ℃ )

Part Number	Color	View Angle	Lens Color	Wave length	Forward Voltage	Luminous Intensity(mcd)
HMHP-W-3528	White	120	Water Clear	-	3.4-3.8V	1500-2000mcd
HMHP-B-3528	Blue	120	Water Clear	465-475nm	3.4-3.8V	500-700mcd
HMHP-G-3528	Green	120	Water Clear	520-525nm	3.4-3.8V	1000-1400mcd
HMHP-R-3528	Red	120	Water Clear	620-625nm	2.2-2.4V	800-1300
HMHP-Y-3528	Yellow	120	Water Clear	590-595nm	2.2-2.4V	600-1000

NOTES:
※2	Forward Voltage has an accuracy of ±0.1V
※3	Dominant wavelength has an accuracy of ±1nm
※4	Luminous Intensity is tested by a tester calibrated by CAS 140B(CIE LED_B) and has an accuracy of 10%

6. Typical Characteristic Curves

7. Dimension of Tape / Reel

7.1 Tape Dimension

7.2 Reel Dimension

8. Precaution in use

8.1 Soldering Conditions

When soldering Power SMD, Heat may affect the electrical and optical characteristics of the LEDs.

In soldering, do not stress the lead frame and the resin part under the high temperature.

The silicone part should be protected from mechanical stress or vibration until the Power SMD return to room temperature after soldering.

Preliminary heating to be at 150 ℃ max. for 180 Seconds max.

Soldering heat to be at 260 ℃ max. for 5 sec. Max.

For manual Soldering is Not more than 3 sec @MAX 350 ℃, under soldering iron

8.2 Storage

▪ Use with 7days after opening packing. Store in 10 to 30 ℃ Power SMD lead frames are plated silver. The silver surface may be affected by environment which contain corrosive gases and so on. Please avoid condition which may cause the Power SMD to corroded, tarnish or discolor.

8.3 Static Electricity

▪ Static electricity or surge voltage damages the Power SMD . It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. ▪ A tip soldering iron is requested to be grounded. An ionizer should also be installed where risk of static. ▪ All devices, equipment and machinery must be properly grounded (via 1MΩ). It is recommended that measures be taken against surge voltage to the equipment that mounts the Power SMD.

8.4 Cleaning

▪	Isopropyl Alcohol or Ethylene Alcohol is recommended in 5 minutes at room temperature. Don’t use unspecified chemical may cause crack or haze on the surface of the epoxy resin.
▪	Before cleaning, a pre-test should be done to confirm whether any damage to the LED will occur.
▪	Freon solvents should not be used to clean the LEDs because of worldwide regulations.